10a, 60v schottky recti er die cpd31x CPD34X features: ? low forward voltage at 10 amps forward current ? low reverse leakage current ? low profile geometry ? metalization suitable for standard die attached technologies ? top metalization optimized for solder process (cpd31x) ? top metalization optimized for wire bonding (CPD34X) maximum ratings (t a = 25 ? c) electrical characteristics (t a = 25 ? c unless otherwise noted) v rrm (v) max v r (v) max i o (a) max i fsm (a) max t j, t stg ( ? c) max bv r (v) min v f @ i f (v) (v) (a) typ max i r @ v r (v) typ max max 60 60 10 250 -65 to +150 60 0.49 0.59 ? 0.67 5.0 10 75 a ? 500 a *50ma 60 *60 ? energy efficiency ? high temperature characterization ? space savings benefits: applications: ? optimized for use as a by-pass rectifier in low profile solar (pv) panels ? reverse polarity protection ? or-ing diode to order samples contact: central?s sales department 631-435-1110 to order the latest chip databook, visit: web.centralsemi.com/search/sample.php die size 85 mils x 85 mils die thickness 5.9 mils 0.8 mils die passivation sin anode bonding pad area 78 mils x 78 mils top side metalization (cpd31x) al/ni/au - 30,000 ?/ 4,000 ?/ 1,500 ? top side metalization (CPD34X) al - 30,000 ? back side metalization ti/ni/au - 1,600 ?/ 5,550 ?/ 1,500 ? scribe alley width 3.15 mils wafer diameter 5 inches gross die per wafer 2,260 *t a =100 ? c typical electrical characteristics samples literature 145 adams avenue ? hauppauge ? new york ? 11788 ? usa ? www.centralsemi.com cpd31x CPD34X product brief p r o d u c t b r i e f
pb cpd31x for further information contact: sales at central semiconductor corp. (631) 435-1110 or visit our website at: www.centralsemi.com innovative discrete semiconductors packing information wafer form ? 100% tested with rejects inked ? use - wn suffix when ordering anti-static polyethylene protective layer esd protective container anti-static foam anti-static foam wafer anti-static polyethylene protective layer anti-static foam anti-static foam esd protective lid sawn wafer sawn wafer adhesive mem brane adhesive mem brane metal frame plastic ring sawn wafer ? available on metal frame or plastic ring ? 100% tested with rejects inked. ? mounted on adhesive membrane on a metal frame or plastic ring. ? use - ws suffix when ordering for metal frame ? use - wr suffix when ordering for plastic ring. chip form ? waffle packed. ? use: - ct, - cm, - cto suffix when ordering. ? - ct (100% tested with rejects removed). ? - cm (100% tested and 100% visually inspected per mil - std -750, [method 2072 transistors] [method 2073 diodes] with rejects removed). ? - cto (100% tested with rejects removed, die orientation as specified by customer.) esd protective cover anti-static polyethylene protective layer esd protective chip tray 145 adams avenue ? hauppauge ? new york ? 11788 ? usa ? tel:(631) 435-1110 ? fax:(631) 435-1824 60v, 10a schottky recti er chip cpd31x CPD34X
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